Decontamination efficiency: ≥90% for dust, radioactive particles and aerosols. Equipment compatibility: Non‑corrosive to metal, paint, plastic and rubber; low‑conductive, no short‑circuit risk. Residue‑free, no clogging, gelling, crystallization or scaling, atomizable. Storage: Stable at ‑30℃~55℃ in normal warehouses, no freezing or degradation. Adsorption: Fast wetting locks dust to avoid rebound. Peelable adhesive film, fast‑curing. Film‑forming: Complete film in 120‑180 min at ambient temperature.